High-density SMT and BGA assembly for IoT and WiFi module OEMs — from first prototype through volume production in Bangalore.
IoT and WiFi module OEMs face a manufacturing problem most don't anticipate: the EMS partner who handles your prototype often can't scale with you. Vishesh handles NPI, pilot runs, and volume production under one quality system — no re-qualification, no supplier change mid-programme.
IoT boards are dense and unforgiving. 0201 passives, BGA, LGA, fine-pitch QFP — our SMT lines handle the full component range with 100% AOI and X-ray on every build. Our IoT PCB assembly and box build capability means we take you from bare board to finished connected device under one roof.
From first article to volume shipment — one facility, one quality system, one point of contact. Request a quote and we'll respond within one business day.
Prototype, pilot run, and volume production under one quality system. Process parameters and build knowledge carry forward — no re-qualification, no supplier change mid-programme.
0201 passives, BGA, LGA, CSP, fine-pitch QFP — the full component range for high-density IoT boards. SMT assembly for IoT with 100% AOI and Unicomp X-ray on every build.
From bare PCBA to finished connected device — enclosure integration, cable assembly, and functional testing at our end-to-end EMS partner facility in Bangalore.
If you're building any of the following, Vishesh's facility and certifications make us a qualified manufacturing partner.
ESP32, ESP8266, and custom WiFi/BT module PCBAs. High-density SMT with fine-pitch placement.
Home automation controller boards, smart plug PCBAs, sensor interface assemblies.
IIoT sensor boards, gateway PCBAs, PLC interface modules. Built for reliability.
Full box build - enclosure integration, cable assembly, functional testing.
Low-power wireless module PCBAs for smart metering, industrial monitoring applications.
| Capability | Detail |
|---|---|
| SMT Lines | 3 lines, 206,700 CPH total |
| Component Range | 0201 to BGA, LGA, CSP, fine-pitch QFP |
| PCB Layers | Up to 16-layer |
| Inspection | 100% AOI, X-ray (BGA/LGA), IPC-certified trainer on-site |
| NPI Support | Prototype, pilot run, and volume production |
| Box Build | Full connected device integration |
| Quality Certification | ISO 9001:2015, IATF 16949:2016 (TÜV Rheinland) |
| Environmental | ISO 14001:2015, ISO 45001:2018 (TÜV NORD) |
| Traceability | Component-level throughout |
| Facility | 45,000 sq ft, Bangalore |
Vishesh's Plant 1 handles all IoT PCB assembly and testing — including fine-pitch SMT, BGA placement, and 100% AOI and X-ray verification. Plant 2 handles mechanical assembly and box build for finished connected devices.
High-density IoT boards require inspection coverage that standard visual checks can't provide. X-ray verification on every BGA and LGA build, combined with component-level traceability from incoming inspection to dispatch, gives your hardware team the data your quality system needs. For a full view of Vishesh's end-to-end EMS partner capability, visit our services overview.
ISO 9001:2015
Quality Management System
Certified by TÜV Rheinland. Valid to November 2028. Covers full PCBA and box build manufacturing operations at Vishesh's Bangalore facility. The quality management foundation your supply chain audit will look for first.
IATF 16949:2016
Automotive-Grade Process Discipline
Certified by TÜV Rheinland. Valid to November 2028. FMEA, APQP, and process control requirements applied to every production run — a level of process discipline that benefits IoT and connected device programmes equally.
ISO 14001:2015
Environmental Management
Certified by TÜV NORD. Valid to November 2028. Environmental management system covering Vishesh's manufacturing operations — relevant for OEMs with sustainability requirements in their supply chain qualification.
ISO 45001:2018
Occupational Health & Safety
Certified by TÜV NORD. Valid to November 2028. Occupational health and safety management system. Demonstrates the operational maturity that responsible supply chain partners require from their manufacturers.
Yes. Vishesh assembles WiFi, Bluetooth, Zigbee, and NB-IoT module PCBAs using high-density SMT with component placement down to 0201, BGA, and LGA. 100% AOI and X-ray inspection on every build.
Yes. Vishesh handles prototype builds, pilot runs, and volume production under one quality system. Your process knowledge and build parameters carry forward from NPI into production without a supplier change.
Vishesh's SMT lines handle components from 0201 passives through BGA, LGA, and fine-pitch QFP packages. X-ray inspection is used for BGA and hidden joint verification.
Yes. Vishesh handles PCBA through to full connected device box build — enclosure integration, cable assembly, and functional testing — under one roof.
Vishesh is based in Bangalore and serves IoT and WiFi module OEMs across smart home, industrial IoT, building automation, and smart metering segments.
Share your requirements. We'll respond within one business day.